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News Release from: Coherent | Subject: Avia 355-23-250
Edited by the Laboratorytalk Editorial
Team on 02 April 2008
High-speed IC die singulation with UV
laser
The Avia 355-23-250 from Coherent promises the highest pulse repetition rate of any Q-switched ultraviolet laser, for high speed integrated circuit die singulation with high yields
This new laser can deliver over 8W of 355nm output at repetition rates of 250kHz and higher The combination of high average power and high pulse repetition rate translates directly into high process throughput with minimal silicon microcracking
This article was originally published on Laboratorytalk on 28 Feb 2003 at 8.00am (UK)
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The Avia-355-23-250 is also unique in terms of output flexibility, making it the only laser that can provide output tailored for both scribing and dicing, according to Coherent.
Thanks to PulseEQ the laser can deliver low pulse energy at a 250kHz repetition rate, which is ideal for gently scribing through the thin (typically 10micron) epitaxial circuitry layers.
Yet the same laser can also be operated at lower repetition rates, with pulse energies as high as 80uJ, making it an optimum tool for dicing (cutting) through the wafer itself.
Because of fully automated active optimisation functions such as PulseEQ, ThermEQ and PosiLock, the pulse repetition rate and pulse energy can be rapidly changed with no effect on the laser's excellent beam quality (M <1.3), high pulse to pulse energy stability (noise < 5%rms at 70kHz), and beam pointing.
The Avia 355-23-250 is said to be the ideal tool for high-throughput micromachining applications, such as scribing low-kappa, semiconductors, dicing thin memory chips, and via hole drilling in printed circuit boards.
Other applications include solar cell micromachining and direct patterning of thin films.
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