Product category:
Cameras and imaging systems
News Release from: Moritex Europe | Subject: Semiconductor inspection system
Edited by the Laboratorytalk Editorial
Team on 25 March 2004
Get under the surface in semiconductor
inspection
System provides sub-surface inspection of semiconductor wafers and devices, unlike near-infrared systems which only see the surface
Moritex Europe has launched an innovative new IR system for inspection of semiconductor wafers and devices Comprising a high-performance 100W halogen-type light source, fibre-optic light guide, telecentric lens and IR sensitive camera, the new system provides a total solution for accelerating assurance of wafer construction accuracy and quality
This article was originally published on Laboratorytalk on 29 Apr 2002 at 8.00am (UK)
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Offering a next generation alternative to near-infrared systems that only see surface quality, the new Moritex IR system provides sub-surface inspection of semiconductor wafers and devices.
The combination of IR light source, operating at 1127nm, and the small depth-of-field provided by the proprietary IR telecentric lens enables accurate and rapid inspection of areas of interest within Si, GaAs, LiNbO3 and LiTaO3 wafers and devices.
Typical applications that will benefit from the new system include wafer-on-wafer alignment, Saw filter inspection, Mems inspection, void inspection, FCB alignment and wafer inspection.
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