Technology combines a low thermal resistance substrate with high optical efficiency silver- and gold-plated reflectors for UV/visible and NIR wavelengths respec
AP Technologies introduces a new generation of super-power LED arrays from Opto Diode.
As ODC's MRA package is designed for use with a wide range of standard LED chips, ODC is able to offer devices from UV at 385nm all the way through to 950nm NIR. Standard devices are single-wavelength but dual- and multi-wavelength versions are possible.
MRA's excellent thermal characteristics mean the LED chips run at far lower temperatures than in conventional moulded packages.
This allows operation at twice the power while still conforming to the chip manufacturer's recommended current and junction temperature. The use of high quality plated reflectors means that 90% of the chip power is coupled into the beam, at least twice the efficiency of ceramic-only LED array packages.
UV devices use non-epoxy encapsulation to enable superior operating lifetime compared to the best epoxy-moulded devices.
A single 99-chip MRA device is compact, easy-to-use and can replace arrays of many hundreds of moulded LEDs so is especially beneficial in applications with critical space constraints and where a high degree of beam uniformity is required.
